搜索附件 |
表面處理 | |||
Surface Treatment | |||
噴錫(含無鉛)厚度 | |||
HASL(LF) | |||
沉錫/Immersion Tin | |||
沉金/Immersion Gold | |||
沉銀/Immersion Silver | |||
抗氧化/OSP | |||
電金/Flash Gold | |||
板料/Laminates | |||
最大層數/MAX.Layers | |||
最大版面尺寸/MAX.Board Size | |||
板厚/Board Thickness | |||
最大銅厚 | |||
Max.Copper Thickness | |||
最小線寬/Min.Track Width | |||
最小線隙/Min.Track Space | |||
最小鉆孔孔徑/M.in Hole Size | |||
最小激光鉆孔孔徑/ | |||
M.in Laser Hole Size | |||
最小孔壁銅厚/ | |||
PTH Wall Thickness | |||
孔徑公差/PTH Dia.Tolerance | |||
板厚與孔徑比/Aspect Ratio | |||
阻抗控制/lmpedance Control |
|手機版|MCU資訊論壇
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